ASE Technology Holding Co., Ltd. business relationships
Companies named in ASE Technology Holding Co., Ltd.’s 20-F filed 2026-04-01, and public companies whose annual reports name ASE Technology Holding Co., Ltd.. Each link shows the sentence it came from. Scores are Engagemii’s AI visibility scores.
- AEO visibility
- 5.4 / 10
- AI naming
- 70 / 100 Top 1% in its category
- Agent readiness
- 5 / 100
- AI adoption
- 0 / 100
Named in ASE Technology Holding Co., Ltd.’s annual report 10
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.” SEC filing
“One of our license agreements with Infineon Technologies AG will remain in effect until expiration of the patents licensed by the agreement, and the other automatically renews each year unless otherwise agreed between the parties.” SEC filing
“Our license agreements with TDK Corporation and DECA remain in effect until expiration of their respective patents licensed by the agreements.” SEC filing
“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.” SEC filing
“Through our strategic alliance with and close geographic proximity to TSMC, we are able to offer our customers a total semiconductor manufacturing solution that includes access to foundry services in addition to our packaging, testing, and direct shipment services.” SEC filing
“our long-term relationships with providers of complementary semiconductor manufacturing services, including our strategic alliance with TSMC.” SEC filing
“TSMC designates us as its non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.” SEC filing
“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.” SEC filing
“...companies involved in the semiconductor manufacturing process, including Infineon Technologies AG, TDK Corporation, and DECA Technologies Inc. The technology we license from these companies includes solder bumping, redistribution, ultra CSP assembly, advanced QFN assembly, wafer-level packaging, and...” SEC filing
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.” SEC filing
Links are read automatically from SEC annual reports (10-K, 20-F, 40-F). In a hand check of random links, about 8 in 10 were real business relationships, so every link carries its source sentence.